Thermal Engineer

RESPONSIBILITIES - Define end-to-end thermal design across NPU/ASIC package → PCB → card (PCIe FHFL/HHHL, OAM, SXM) → system (server chassis) levels, selecting and designing heatsinks, heat pipes, vapor chambers, cold plates, and TIM - Evaluate trade-offs across cooling approaches — air, liquid, 2-phase, and immersion — and run CFD simulations (FloTHERM, Icepak) including EM-thermal co-simulation using power maps from HFSS/SIwave/PowerDC - Validate thermal performance through wind tunnel testing, hands-on temperature measurement (thermocouples, IR cameras, RTDs), and DOE-based simulation-to-measurement correlation - Support reliability testing including thermal cycling and burn-in - Partner with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware, and negotiate thermal specifications with OEM/ODM and hyperscale customers - Author thermal design guides, reference designs, and test reports, and ensure compliance with form-factor standards (OCP OAM, PCIe CEM, NVIDIA SXM, etc.) MINIMUM QUALIFICATIONS - Thermal Modeling & Simulation: Utilize computational fluid dynamics (CFD) to simulate heat transfer and fluid flow. - System Design: Design active and passive cooling solutions, including heatsinks, fans, liquid cooling coldplate. - Thermal Testing: Evaluation for NPU card thermal performance with using multi temp recorder and FLIR camera or thermocouples. - Collaboration: Work closely with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware. PREFERRED QUALIFICATIONS - Experienced GPU or NPU card development or server development for datacenter - Flotherm or Icepak preferred - English communication for business level - Positive and proactive engineer JOB LOCATION - Dongtan / Seoul - The primary work location for this position is Dongtan, with the option to work in either Dongtan or Seoul. Candidates who can work in Dongtan are preferred. CONTACT - recruit@furiosa.ai