Staff TPM [L6-2] (TSE/CIC)

본 공고는 재직 임직원을 대상으로 하는 사내 공모 전용입니다. ( 임직원 추천은 Link 로 진행 ) This posting is exclusively for internal employees. (Employee referrals are submitted via the Link ) 지원 시에는 반드시 첨부된 ‘ 사내 공모 지원서 양식 ’을 작성한 후, 쿠팡 이메일 계정 으로 접수해 주시기 바랍니다. To apply, please complete the attached ‘ Internal Transfer Request Form ’ and submit it via your Coupang email address . 사내 공모 정책: [ Link ] Internal Transfer Policy: [ Link ] Company Introduction We exist to wow our customers. We know we're doing the right thing when we hear our customers say, "How did we ever live without Coupang?" Born out of an obsession to make shopping, eating, and living easier than ever, we're collectively disrupting the multi-billion-dollar e-commerce industry from the ground up. We are one of the fastest-growing e-commerce companies that established an unparalleled reputation for being a dominant and reliable force in South Korean commerce. Our mission to build the future of commerce is real. We push the boundaries of what's possible to solve problems and break traditional tradeoffs. Join Coupang now to create an epic experience in this always-on, high-tech, and hyper-connected world. Role Overview You will lead the architectural vision for our next-generation data centers, transitioning our global footprint from traditional colocation models to high-density AI Factories. You are responsible for the physical and logical blueprint of the facility—ensuring that our "white space" can support 100kW+ racks, liquid-to-chip cooling, and the massive throughput requirements of 800G/1.6T networking. Responsibilities Facility Strategy: Design the "Basis of Design" (BOD) for hyperscale facilities, including site selection, building massing, and modular "pod" scalability. Thermal Management: Architect the transition from air-cooled data halls to Hybrid Cooling environments (Direct-to-Chip, Rear Door Heat Exchangers, and Immersion Cooling) to support high-TDP AI chips. Power & Energy: Partner with electrical engineers to design high-availability power chains (N+1/2N) capable of supporting 50MW+ of IT load per hall. Evaluate the integration of Small Modular Reactors (SMRs) or hydrogen fuel cells for onsite power. Network & Fabric Topology: Define the physical layout for OSFP-based high-radix fabrics. Optimize cabling pathways and "meet-me-room" designs to minimize signal degradation for InfiniBand and RoCE v2 compute planes. Modular Construction: Drive the adoption of modular "skid-based" deployments to accelerate construction timelines by 30% without sacrificing reliability or efficiency (PUE). Sustainability & ESG: Ensure designs meet 2026 carbon-neutrality standards by implementing waste-heat reuse for local district heating and optimizing Water Usage Effectiveness (WUE). Qualifications Education B.Tech/M.S. or Ph.D. in Computer Science, Electrical Engineering, or a related field (or equivalent industrial experience) Required Technical Expertise Physical Infrastructure: Deep understanding of rack densities (moving from 15kW to 100kW+), busways, and floor loading for heavy liquid-cooled systems Hardware Lifecycle: Mastery of the latest server form factors, including E1.S/E3.S storage and the mechanical requirements of NVIDIA Blackwell/Rubin rack systems Networking Standards: Expert knowledge of the physical layer (OSFP/QSFP-DD), fiber types (OM5/Single-mode), and OSPF/BGP routing at the facility scale BIM & Digital Twin: Proficiency in Revit, AutoCAD, and Digital Twin platforms to simulate airflow, power distribution, and maintenance accessibility before breaking ground Preferred Qualifications 10+ years in mission-critical facility design or lead architectural roles at a Hyperscaler (AWS, Google, Meta) or Tier-1 Provider (Equinix, Digital Realty) Expertise in Uptime Institute Tier Standards and LEED Platinum certifications Experience with "AI-driven DCIM" (Data Center Infrastructure Management) tools for predictive maintenance Domain Skills Needed Cooling: Direct-to-Chip (DLC), CDU Integrati…