Sr. Wet Etch Process Development Engineer

Position Summary: We are looking for a hardworking and passionate Wet Etch Process Development and Integration Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management. Major Area of Accountability: • New process development/transfer/integration/ownership in a manufacturing environment. • Develop or integrate robust manufacturable process recipes for Foundry customers in Wet Etch / Cleans. • Lead one or more teams for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications. • Utilize metrology tools to characterize and document process results for transfer to production. • Investigate and drive integration changes for improved device performance and yield improvement. • Lead a team of process integration and tool engineers to find processing marginalities and make improvements. • Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes. • Monitor and improve electrical test parametrics through feedback and improvement to integration. • Directly interface with customers as a team and technical leader. • Act as technical lead and project manager integrating customer device requests with team activities. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications: Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent. Experience and Skills: • Back-end-of-line (BEOL) or front-end-of-line (FEOL) CMOS, MEMS and/or packaging fab processing tools knowledge/experience. • 10 years + experience with BS, 7-10 years of experience with MS, 5+ years of experience with PhD. • Strong Wet Etch experience including recipe development. • MEMS, Photonics, CMOS or Packaging device and integration knowledge (or similar) with relevant combination of years of experience (10+ years) and/or advanced degree. • Experience in wafer fab process development. • Prior experience with chemical selection. • Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications. • Demonstrated project management and team leadership skills and/or defined training and relevant experience. • Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes. • Demonstrated experience with customer interfacing to solve problems and transfer processes for co-development of products. • Can work both independently and lead cross-functional teams for problem solving. US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance. Preferred Qualifications: • PVD, CVD, electroplating Cu and/or Au, dry or wet etch, electrical test, metrology, photolithography, wafer bonding or CMP.