Senior Director, Advanced Packaging Disruptive Technology

**Who We Are** Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. **What We Offer** Salary: $200,000.00 - $275,000.00 Location: Austin,TX, Covington,GA, Santa Clara,CA You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our [benefits](https://hrportal.ehr.com/applied/). The Senior Director, Principal MTS is a senior technical leader responsible for defining and driving panel scaling technology strategy and customer-facing execution across next-generation advanced packaging and substrate platforms. This role leads cross-functional alignment to accelerate panel-level form factor scaling, RDL scaling, and ecosystem readiness—connecting customer needs to integrated equipment/process solutions and strategic partnerships. This position operates at the intersection of technology roadmaps, account strategy, and disruptive pathfinding, translating panel scaling inflections into executable customer engagements, demo programs, and internal investment priorities. **Key Responsibilities** · Panel Scaling Technology Strategy & Roadmap Ownership : · Own the panel scaling technology roadmap across form factor scaling, interconnect scaling, and substrate scaling, including transitions from wafer-based approaches to panel-based architectures. · Define technology inflections and integration milestones for advanced panel build-up and align internal roadmaps to customer adoption cycle Ecosystem & Partnership Development · Build and manage a partner ecosystem spanning substrate makers, material suppliers, OSATs, foundries, and research institutes to close panel scaling gaps (design rules, warpage, overlay, defectivity, metrology/inspection, reliability). · Identify, evaluate, and activate disruptive partners and collaborations to accelerate panel readiness and strengthen differentiation. Program Governance & Executive Communication o Lead executive-ready storytelling and decision frameworks o Drive internal alignment across engineering, product lines, marketing, and finance on portfolio gaps and priorities required to lead in advanced panel packaging. · Resolves exceptionally complex field process issues utilizing systematic troubleshooting methodology generally involving multiple processes. Create a mechanism to communicate issues, track progress and pull resources from multiple divisions and/or functions. Uses sound statistical techniques like and problem solving methodologies DOEs (Design of Experiment) to quickly determine root cause and action plans. Communicates learnings from this portion to rest-of-world to strengthen the product packages. · Serves as the customer expert across a broad range of exceptionally complex products. Plays a key role in defining product strategy and identifying gaps. Provides feedback to division heads on process and hardware improvements to meet customer roadmap requirements. · Directs the positioning…