Senior Assembly Development Engineer

About Indium Phosphide (InP) Technology The world’s communications infrastructure depends on semiconductor lasers, and particularly those based on indium phosphidetechnology. Indium phosphide lasers are engineered to emit at wavelengths that are optimal for long-distance transmission through fiber optics. In short, they enable the optical networks that form the global internet. Coherent’s broad portfolio of InP components includes application-specific Fabry-Pérot lasers, directly modulated lasers (DMLs), and tunable lasers. It also includes photodiodes for high-speed receivers and power monitoring. In 2022, we introduced 200 Gbps indium phosphide electro-absorption modulated lasers (EMLs) for high-speed datacenter transceivers. This design provides our customers with the most advanced, robust, and cost-competitive laser devices for their 800G and next-gen 1.6T datacom transceiver designs. As the Senior Process Development Engineer, you will lead all aspects of development engineering, work with contract manufacturers, for our high-power CW lasers and their packages. This position demands a hands-on approach to product performance, yield optimization, and production troubleshooting. Your expertise will guide the seamless integration of new products into existing systems and ensure our continued leadership in the market. **Primary Duties & Responsibilities** **Development Engineering Leadership:** Oversee the entire engineering development effort on chip-on-carrier assembly and/or package/module development for high-power CW lasers, high speed PD, and/or co-packaged optics, ensuring optimal performance and yield. **Manufacturing Collaboration:** Work closely with manufacturing teams and Fremont product engineering and logistic team to address needs and optimize performance with contract manufacturers **Cross-Functional Teamwork:** Collaborate with Fremont Product Engineers, Design, Planning, Logistic team to ensure good quality product on time delivery on schedule **Data Analysis:** Utilize statistical methods to analyze reliability and test data, identifying trends and potential issues to improve product yield and quality; Perform thermal or thermomechanical modeling and analysis during the chip bonding process. **Education & Experience** - A Master’s degree or higher in Applied Physics, Materials Science, Electrical Engineering or related field. - At minimum 5 years’ of industrial experience in engineering development, preferably with a focus on semiconductor lasers or related optoelectronic devices such as photodiodes, semiconductor lasers and other devices with InP based materials. Direct hands-on experience in semiconductor chip packaging is highly desired. **Skills** - Proficient in data analysis and statistical evaluation related to product engineering. - Exceptional leadership and interpersonal skills, capable of managing complex projects and diverse teams. - Strong problem-solving skills with a proactive approach to addressing and preempting issues. - Willingness to travel frequently to manufacturing sites. - Excellent communication skills, essential for effective teamwork and cross-disciplinary collaboration. **Working Conditions** - This role will be based on-site in Fremont, CA. - Regular use of a computer and other office equipment is necessary. **Physical Requirements** - Sitting for extended periods while working on a computer or in meetings. - Use of hands and fingers for typing, writing, and handling documents. - Occasional lifting of objects or materials up to 20 pounds for administrative tasks. - Ability to communicate verbally and in writing. **Safety Requirements** All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards. **Quality and Environmental Responsibilities** Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and re…