Principal Engineer – RIE Module Engineering

The RIE Module Principal Engineer is responsible for providing technical leadership and strategic direction for Reactive Ion Etch (RIE) manufacturing operations. This role owns module-level performance across safety, quality, yield, availability, cost, and output while driving long-term technology and operational roadmaps. The successful candidate will serve as the technical authority for multiple RIE platforms, lead cross-functional improvement initiatives, influence capital planning decisions, and develop engineering talent within the organization. This position requires deep semiconductor manufacturing expertise, strong business acumen, and the ability to lead complex initiatives through influence rather than direct authority. ### Responsibilities **Technical Leadership** - Serve as the technical authority for RIE process and equipment performance across multiple technologies and toolsets. - Develop and execute module strategy aligned to fab objectives for yield, availability, cycle time, cost, and quality. - Architect control strategies utilizing SPC, FDC, APC, and advanced analytics. - Establish equipment standards, chamber matching strategies, and process control methodologies. - Lead technical reviews, risk assessments, and technology transfer activities. **Operational Excellence** - Own module KPIs including: - Tool Availability , COUP - Yield , Defectivity - Lot Holds , Cycle Time - Cost Reduction - Drive systematic reduction of chronic tool and process issues through structured root-cause analysis. - Lead recovery efforts for high-impact manufacturing excursions. - Implement sustainable corrective and preventive actions that prevent recurrence. **Strategic Planning & Capital Management** - Develop business cases supporting capital investments, upgrades, and productivity projects. - Influence equipment selection, supplier strategy, and technology roadmaps. - Assess future manufacturing needs and identify capacity, capability, and reliability gaps. - Provide recommendations balancing risk, cost, and operational impact. **Cross-Functional Leadership** - Lead cross-functional teams consisting of Process Engineering, Equipment Engineering, Manufacturing, Quality, Facilities, and Product Engineering. - Represent the module during site leadership reviews, customer audits, and executive presentations. - Partner with global engineering organizations to deploy best practices and standardize processes. **Talent Development** - Mentor and coach engineers across multiple levels. - Develop technical competency frameworks and training roadmaps. ### Qualifications **Education** - Bachelor's Degree in: - Chemical Engineering, Semiconductor Engineering, Related Technical Discipline **Experience** - Minimum 10 years of semiconductor manufacturing experience. - Minimum 7 years in RIE Process Engineering, Equipment Engineering, or Module Engineering roles. - Demonstrated leadership of large-scale improvement projects. - Experience supporting high-volume semiconductor manufacturing environments. **Technical Skills** - Deep understanding of plasma etch processes and RIE equipment. - Expertise in statistical process control (SPC). - Experience with: - DOE methodology - Fault Detection and Classification (FDC) - Advanced Process Control (APC) - Yield analysis - Root Cause Analysis - FMEA - Process qualification methodologies - Strong data analytics capabilities. **Preferred Qualifications** - Master's Degree or PhD in Engineering or Physical Sciences. - Experience with TEL and/or Lam Research RIE platforms. - Experience supporting automotive, power semiconductor, or image sensor technologies. - Knowledge of chamber matching, endpoint systems, and advanced process control applications. onsemi is excited to share the base salary range for this position is **$114,000-$193,700** exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, an…