Member of Technical Staff (MTS) of Advanced Packaging & Module Engineering

Position Summary The Member of Technical Staff (MTS) of Advanced Packaging & Module Engineering is a strategic leader responsible for defining and executing the vision, scope, and long-term strategy for module engineering and advanced packaging across process and equipment. This role drives the development and industrialization of next-generation semiconductor packaging solutions from R&D through high-volume manufacturing (HVM), integrating technology innovation with operational excellence to deliver differentiated business outcomes. The MTS is accountable for end-to-end module performance, including process development, qualification, statistical process control (SPC), and capability optimization. This leader partners cross-functionally across engineering, operations, and external stakeholders to deliver scalable, reliable, and cost-effective solutions. This role reports directly to the SVP of Engineering and operates as a peer to other senior engineering leaders, with enterprise accountability for advanced packaging and module engineering strategy and execution. Major Area of Accountability Technological Roadmap: Define and drive the advanced packaging technology roadmap in partnership with the CTO, aligning with business objectives and market trends. Translate strategy into execution through integrated process and equipment development, ensuring clear linkage to measurable business outcomes. Own the enterprise vision, scope, and direction for Module Engineering (process and equipment). Continuous Improvement & Accountability: Drive a culture of data-driven decision-making and continuous improvement through operational metrics, process discipline, and structured performance reviews. Act as a strategic technical partner to people leaders by identifying operational pain points, execution gaps, and performance opportunities, enabling leadership teams to drive accountability and improve process capability, execution rigor, and business outcomes. Process Development & Module Performance: Lead the development, optimization, qualification, and documentation of advanced packaging technologies (e.g., 2.5D/3D integration, hybrid bonding, wafer-level packaging). Own end-to-end module performance, including yield, cost, cycle time, and reliability, and integrate process and equipment strategies to enhance factory capability and efficiency. Cross-Functional Leadership & Execution: Lead as a cross-functional liaison for teams across operations, Advanced Technology Services, Platform Technology, quality, supply chain, and IT/automation to enable seamless technology transfer, resolve complex technical challenges, and accelerate time to market. Yield & Quality Improvement: Drive improvements in process capability (Cpk), yield, quality, cost, and cycle time through statistical process control (SPC), advanced analytics, and data-driven problem-solving methodologies. Establish scalable continuous improvement frameworks (e.g., tiered management, visual management, A3/8D, Kaizen) and provide technical leadership to enable operational teams and people leaders to drive sustainable performance improvements and execution rigor across the organization. External Partner & Customer Engagement: Serve as the primary technical interface for customers, research partners, and equipment/material suppliers to align technology roadmaps, support technology qualifications, and drive execution against business and operational objectives. Leverage industry trends, customer feedback, and competitive benchmarking to accelerate adoption of advanced manufacturing capabilities in process control, automation, and process development (e.g., APC, AI-enabled SPC), while enabling scalable and manufacturable solutions. Project & Program Management: Lead the execution of complex development and qualification programs from concept through HVM, ensuring alignment to technical and business objectives. Govern portfolio prioritization and phase-gate discipline, and implement KPI a…