Director of Advanced Packaging Process Engineering

Position Summary: Our Process Engineering Director is accountable to ensure the Process Engineering Team is continuously optimizing our manufacturing processes to be highly efficient with high yields and low cost. This role is also responsible for leading and developing Process Engineering leaders and teams to strengthen capability, accountability, and execution across the organization. In addition, they will closely collaborate with the Advanced Technology Services and Advanced Packaging Development Teams to create new manufacturing processes and capabilities, enabling the next generation of exciting new products to be manufactured at SkyWater. Responsibilities: Define and refine a vision for the engineering team to create a purposefully driven, highly-effecitve team Build effective teams to solve complex problems Lead, coach, and develop Process Engineering leaders to strengthen team capability, accountability, and execution Attract top talent and build pipeline of high potential engineers for future growth Ensure effective definition and deployment of Key Performance Indices (KPI’s) and Objectives and Key Results (OKR’s) to ensure operational and enterprise objectives are achieved Ensure collaboration within operations and other business functions to achieve enterprise objectives. Ensure deployment and effective use of structured problem-solving methodologies to achieve effective Root Cause Corrective Action Stay current of emerging technology trends to ensure SkyWater is equipped with cutting edge capabilities in process control, factory automation, and process development Work with minimal supervision, balancing competing priorities, to serve the needs of the enterprise The job also requires performing other duties as assigned. Required Qualifications: Education: B.S. or M.S. Degree in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant engineering discipline. MBA preferred. Experience and/or Training: Minimum of 10 years experience of semiconductor technology development, advanced packaging and/or process integration experience Experience in Advanced Packaging preferred Proven track record of driving advanced packaging technology and/or semiconductor wafer fab technology from R&D to HVM (high-volume manufacturing) Expert knowledge of semiconductor manufacturing processes(Litho, Etch, Deposition, CMP, etc) and/or advanced packaging technologies and formats (FOWLP, FCBGA, SiP, RDL, 3DIC, HBM). Direct experience with FOWLP, TSV, bonding preferred. Minimum of 5 years of management experience Experience with application of structured problem solving methodology Experience with Design of Experiments Experience with automated fault detection and control systems (FDC) Positive interpersonal skills, highly energetic and self motivated Outstanding communication skills - both written and verbal Demonstrated ability to meet commitments and deliver results Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs Knowledge of SPC is preferred US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance.